Silicon Wafer

At Kanetora, we don’t just supply wafers – we build lasting partnerships based on trust, quality, and flexibility. Passionate about advancing the semiconductor industry, we’re here to support your growth with top-tier wafer dicing, grinding, thinning, and bonding services. Whatever your needs, we’ll work closely with you to create the perfect solution. Let’s connect today and explore how Kanetora can help you move forward.

Bare Silicon Wafer

Bare silicon wafers are the foundation for most semiconductor devices. At Kanetora, we offer a complete range of CZ and FZ silicon wafers in multiple sizes and surface finishes, ideal for applications ranging from process development to mass production.

Epi Wafer

Epitaxial wafers (EPI wafers) are essential for high-performance semiconductor devices requiring enhanced electrical properties and precise doping control. At Kanetora, we provide high-quality EPI wafers with uniform thickness, low defect density, and excellent surface finish, supporting advanced applications in power, RF, and logic devices.

SOI Wafer

SOI wafers feature a thin layer of silicon on top of an insulating oxide layer, offering superior electrical isolation, reduced parasitic capacitance, and enhanced performance in RF and low-power applications. Kanetora provides tailored SOI wafers for advanced semiconductor needs.

Compound Semiconductor

Compound semiconductor wafers, such as GaN and SiC, enable high-efficiency, high-frequency, and high-voltage applications that silicon alone cannot achieve. Kanetora offers advanced compound wafers to support next-generation power electronics, communication, and sensing technologies.